ʻOkoʻa ka paipu metala keleawe pipeline profile o ka ʻokoʻa o kāna mau koi no ke kaʻina hoʻoheheʻe keleawe he ʻokoʻa ia mai ka mea o nā ʻāpana kila maʻamau i hoʻopaʻa ʻia no laila pehea e koho ai i kūpono no ka hoʻoili ʻana i ka uea me ke kaʻina hana keleawe he kumuhana koʻikoʻi e koho maʻamau i ke kaʻina electroplating ma muli o ka mua electroplating mea pono no ka plating ʻO ia hoʻi, ka huahana ua hana mua, a laila electroplating, e like me ka mānoanoa, olinolino, paakiki a me ka dispersion hiki, etc., a me kekahi o ka pono o kēia manawa a me ʻO nā koi o ka wikiwiki o ka hōʻiliʻili ʻana e ʻike i ka mea e pono ai ka uhi mua ʻana o ka uhi kikowaena keleawe a me ka uhi ʻana i waho, a ʻo nā hiʻohiʻona o ke keleawe pipeline profile processing electroplating ʻo ia ke kaʻina hana o ka uea a me ke kaʻina electroplating i kekahi manawa synchronized ʻO ia hoʻi, ʻo kekahi ma hope o ka plating, kekahi mea mua ma hope o plating a hiki i ka electroplating o ka huahana uea, akā, i loko o ka traction o ka laina mīkini koho 'ike loea hou i ka hoʻohana like 'ole e like me ka uea a me ka uhi koi, akā, no hoi noonoo electroplating. nā limahana i ka uea hele wikiwiki traction o ka lōʻihi o ka hana laina a me nā kumu 'ē aʻe adaptability E pili ana i CO2 kinoea kuʻihao uea no ka mālama 'ana, no ka mea, o ke keleawe ma ka uea i hoʻopaʻa 'ia ka nui i ka palena koʻikoʻi, e like me ke keleawe maʻiʻo no ka huina leo i loko o 0.52 (ka hapa nui) o ka mea kūʻai aku, no ka ʻili lahilahi loa, ʻo ke ʻano hoʻoheheʻe kemika ʻo ia hoʻi, hiki ke hoʻokō i nā koi, akā no ka hoʻohana ʻana o ka home i kēia manawa i ke ʻano kuʻuna e pani i ka pā keleawe, ʻAʻole hiki ke hoʻokō i ka mana paʻa Plating kala i nā koi huahana A i ka hoʻomaʻamaʻa ʻana e koho i ke kaʻina hana kiʻi kiʻi mua, ka hoʻonui ʻia ʻana o ke keleawe a me ka lahilahi i ke kaha kiʻi, e hiki ai i ka koi huahana ʻO kēia ala e hāʻule pinepine ai ka uhi Hōʻike i ka hanana No laila, koho. he maikaʻi hoʻopaʻa ikaika a me ka ductility o ke keleawe plating kaʻina no ka e pili ana kinoea pale kuʻihao uea mea nui loa I ka mea hou hiki ke hana kilika nā huahana hoʻokahi manawa i ka holomua o ka kemikala keleawe plating o ke keleawe paipu 'enehana i mua, hiki wale ke koho i ka mua. axis diameter, huki hou i nā huahana ma hope o ka ʻenehana hoʻopaʻa keleawe e kūpono i kēia ʻenehana hana pono he cyanide copper plating a i ʻole matte acidic copper plating No ka mea nui loa ka ʻawaʻawa o ka cyanide, i ka metallurgy copper pipe material processing industry he kakaikahi ka poʻe e hoʻohana I kēia manawa, ʻoi aku ka nui ʻO ke ʻano kaulana ʻo ia ka leaching keleawe kemika a laila hoʻopaʻa i ke keleawe keleawe a laila kiʻi i hoʻohana ʻia no ka hoʻopaʻa ʻana i ke keleawe keleawe no ka hoʻoheheʻe keleawe ʻana a i ʻole ka pyrophosphate keleawe i loko o ka ʻoihana hoʻoili uea palahalaha e koho pū kekahi. ʻO ka hoʻololi ʻana i ke keleawe keleawe kahiko he keleawe sulfate a me ke kaʻina sulfuric acid wale nō i ka manawa pōkole loa e hiki ke loaʻa kahi pani pani lahilahi loa, i ka mānoanoa o ka pā keleawe ma luna, ʻaʻole ikaika ka ikaika paʻa inā i loko o kēia kemika hoʻololi plating ka manawa immersion. lōʻihi, ʻaʻole wale e hoʻohui i ka mānoanoa o ka uhi ʻana, akā e hoʻoheheʻe ʻia ka uhi ʻana a me ka porous, ʻo ka hao matrix e hoʻopuka pū i ka corrosion, ua emi nui ka ikaika o ka uea. ʻO ia ka hoʻohui ʻana i nā mea hoʻohui me ka hopena blocking i loko o ka hopena copper plating solution, i mea e hoʻonohonoho pono ai ke kaʻina hana i nā additives makemake a me kekahi hopena māmā i ka pono e loaʻa i kahi mānoanoa a i ʻole nā ​​​​huahana uea hoʻopili mānoanoa, ke koho ʻana o ka pani pani pani lalo e lilo. akahele loa Ma ka liʻiliʻi loa, ʻaʻohe mea paʻa e hoʻololi i ka hoʻololi ʻana i ke kaʻina hana electroplating keleawe mānoanoa ma mua, e pili ana i ka mānoanoa o ka hoʻoheheʻe keleawe, pono ka ʻenehana paʻa e koho i ke ʻano electrochemical o precoated precoated me. ʻO ka cyanide copper plating nickel plating a me ka P kiʻekiʻe ma mua o ka pyrophosphate copper plating ke kaupaona ʻana i nā pono a me nā pōʻino, i ka ʻoihana kiʻi uea, electroplating nickel plating e like me ka precoated render ʻoi aku ka maikaʻi ʻOiai hiki i ka pā keleawe mānoanoa ke koho i ka acidic sulfate copper plating ʻO kēia no ka mea ma hope o ke kaʻina hana, ka waikawa. Hiki ke hoʻololi i ke keleawe keleawe i nā koi o ka wikiwiki electroplating i kēia manawa hiki ke hiki i 30 ~ 50A / dm2, no laila ʻAʻole pono e koho ʻia ka wikiwiki o ka hōʻiliʻili ʻana ma ke ʻano like ʻole, ʻaʻole pono ke koho ʻia ʻo cyanide copper plating no ka pollution environment, a me ka pyrophosphate copper plating no ka paʻakikī ʻana, ʻaʻole wale ke kumukūʻai kiʻekiʻe, a ʻaʻole kūpono no ka hana i kēia manawa. kiʻekiʻe-wikiwiki electroplating o kaʻakika copper plating, i ka wā e piʻi ai ka mānoanoa o kēia manawa, e piʻi aʻe ka wikiwiki deposition o ka uhi i ka manawa like.