ʻOkoʻa ka paipu metala keleawe pipeline profile o ka ʻokoʻa o kāna mau koi no ke kaʻina hoʻoheheʻe keleawe he ʻokoʻa ia mai ka mea o nā ʻāpana kila maʻamau i hoʻopaʻa ʻia no laila pehea e koho ai i kūpono no ka hoʻoili ʻana i ka uea me ke kaʻina hana keleawe he kumuhana koʻikoʻi e koho maʻamau i ke kaʻina electroplating ma muli o ʻO ka mea mua electroplating pono pono no ka plating ʻO ia hoʻi, ua hana mua ʻia ka huahana, a laila electroplating, e like me ka mānoanoa, ka ʻōlinolino, ka paʻakikī a me ka dispersion hiki, etc. ʻO ka uhi mua ʻana o ka uhi ʻana i ke kikowaena keleawe a me ka uhi ʻana i waho, a ʻo nā hiʻohiʻona o ke keleawe pipeline profile processing electroplating ʻo ia ke kaʻina hana o ka uea a me ke kaʻina electroplating i kekahi manawa synchronized ʻO ia hoʻi, ʻo kekahi ma hope o ka plating, ʻo kekahi ma hope o ka plating. ka electroplating o ka huahana uea, akā, i loko o ka traction o ka laina mīkini koho 'ike loea hou i ka hoʻohana like 'ole e like me ka uea a me ka uhi koi, akā, no hoi noonoo electroplating limahana e uea hele māmā holo traction o ka lōʻihi o ka hana laina a me nā mea'ē aʻe. mea adaptability E pili ana i CO2 kinoea kuʻihao uea no ka mālama 'ana, no ka mea, o ke keleawe ma ka uea i hoʻopaʻa 'ia ka nui i ka palena koʻikoʻi, e like me ke keleawe maʻiʻo ma ka leo leo e pono i loko o 0.52 (mass hakina) o ka solder, no ka loa lahilahi uhi. Hiki ke hoʻokō i nā koi, akā ma muli o ka hoʻohana ʻana o ka home i kēia manawa i ke ala kuʻuna e pani ai i ka plating keleawe, ʻaʻole hiki i ke kala paʻa ke hoʻokō i nā koi o ka huahana. ka hoʻonui a me ka thinning i ke kaha kiʻi, e hiki i ka huahana koi ʻO kēia ala e hāʻule pinepine ai ka uhi ʻana Hōʻike i ke ʻano No laila, koho i ka ikaika hoʻopaʻa maikaʻi a me ka ductility o ke kaʻina hana copper plating no ka mea nui loa i ka uea hoʻoheheʻe ʻia i ke kinoea. ʻO nā huahana i ka wā e kūleʻa ai ka hoʻopaʻa ʻana i ke keleawe keleawe o ka ʻenehana keleawe i kēia manawa ma mua, hiki wale nō ke koho i ke anawaena axis mua, huki hou i nā huahana ma hope o ka ʻenehana hoʻoheheʻe keleawe kūpono i kēia ʻenehana hana pono he cyanide copper plating a i ʻole matte acidic copper plating No ka mea ʻawaʻawa o Nui loa ka cyanide, i loko o ka ʻoihana hoʻoheheʻe ʻana i nā mea hao keleawe he kakaikahi wale nō ka poʻe e hoʻohana nei I kēia manawa, ʻo ke ʻano kaulana loa ʻo ia ka chemical copper leaching a laila mānoanoa ka pā keleawe a laila kiʻi i hoʻohana ʻia no ka hoʻomoʻa ʻana i ke keleawe keleawe no ka hoʻoheheʻe keleawe a i ʻole ka pyrophosphate copper plating. i loko o ka uea palahalaha 'oihana no hoi koho kemika keleawe plating ku'una pani keleawe plating he keleawe sulfate a me ka sulfuric acid kaʻina wale nō i loko o ka manawa pōkole loa hiki ke loaʻa i ka loa lahilahi pani pani, ma luna o ke keleawe plating mānoanoa, paʻa ikaikaʻaʻole ikaika ina ma keia. He lōʻihi loa ka manawa o ka hoʻoheheʻe ʻia ʻana o ke kinikini, ʻaʻole wale ia e hoʻohui i ka mānoanoa o ka uhi ʻana, akā e hoʻoheheʻe ʻia ka uhi ʻana a me ka porous, ʻo ka hao matrix e hana pū i ka corrosion, ua emi nui ka ikaika o ka uea ʻO ke ʻano o ka hoʻomaikaʻi ʻana ʻo ka hoʻohui ʻana i nā mea hoʻohui me ka hopena pale i loko. ka pani keleawe plating solution, no laila ke kaʻina hana hoʻololi i nā mea hoʻohui makemake a me kekahi hopena māmā i ka pono e loaʻa i kahi mānoanoa a i ʻole nā ​​​​huahana uea paʻa paʻa, ke koho ʻana o ka pani pani ʻana i lalo e makaʻala loa Ma ka liʻiliʻi loa, ʻaʻohe paʻa. e hoʻololi i ka hana ʻana i ke kaʻina hana electroplating keleawe mānoanoa ma mua, e pili ana i ka mānoanoa o ka pā keleawe, pono ka ʻenehana paʻa e koho i ke ʻano electrochemical o precoated precoated me ka cyanide copper plating nickel plating a me ka P kiʻekiʻe ma mua o ka pyrophosphate copper plating ke kaupaona ʻana i nā pono a me nā hemahema, ma ʻoihana kaha kiʻi uea, electroplating nickel plating e like me ka precoated render ʻoi aku ka maikaʻi ʻOiai ke koho ʻana i ke keleawe keleawe mānoanoa ke koho i ka acidic sulfate copper plating ʻO kēia no ka mea ma hope o ka hoʻoponopono kaʻina, hiki ke hoʻololi i nā koi o ka wikiwiki electroplating i kēia manawa hiki ke hiki i 30 ~ 50A. /dm2, no laila ʻaʻole pono e koho ʻia ka wikiwiki o ka hōʻiliʻili ʻana ma ke ʻano like ʻole, ʻaʻole pono e koho ʻia ka cyanide copper plating ma muli o nā pilikia haumia o ke kaiapuni, a me ka pyrophosphate copper plating ma muli o ke ʻano paʻakikī, ʻaʻole wale ke kumu kūʻai kiʻekiʻe, a ʻaʻole kūpono no ka hana i kēia manawa. hōʻike i ka kiʻekiʻe-wikiwiki electroplating o kaʻakika copper plating, i ka wā e hoʻonui ai ka nui o kēia manawa, e piʻi aʻe ka wikiwiki deposition o ka uhi i ka manawa like.