ʻOkoʻa ka paipu metala keleawe pipeline profile kaʻina hana o kāna mau koi no ke kaʻina hana keleawe keleawe he ʻokoʻa ia mai ka mea o nā ʻāpana kila maʻamau ka hoʻopaʻa ʻana i ke keleawe no laila pehea e koho ai i kūpono no ka hoʻoili ʻana i ka uea me ke kaʻina hana keleawe he kumuhana koʻikoʻi e koho pinepine i ke kaʻina electroplating ma muli o ka mua electroplating mea pono no ka plating ʻO ia hoʻi, ua hana mua ʻia ka huahana, a laila electroplating, e like me ka mānoanoa, ka ʻōlinolino, ka paʻakikī a me ka dispersion hiki, etc. ʻO ka uhi mua ʻana o ke keleawe keleawe waena a me ka uhi ʻana i waho, a me nā ʻano o ke keleawe pipeline profile processing electroplating ʻo ia ke kaʻina hana o ka uea a me ke kaʻina electroplating i kekahi manawa synchronized ʻO ia hoʻi, ʻo kekahi ma hope o ka plating, ʻo kekahi ma hope o ka plating ʻoiai ka electroplating o ka uwea huahana, akā i loko o ka traction o ka laina mīkini koho 'ike loea hou i ka hoʻohana like 'ole e like me ka uea a me ka uhi koi, akā, noʻonoʻo electroplating limahana i ka uea hele māmā holo traction o ka lōʻihi o ka hana laina a me nā kumu 'ē aʻe adaptability E pili ana i CO2 kinoea welding uea no ka mālama, no ka mea. ʻO ka nui o ke keleawe ma ka uea i hoʻopili ʻia i ka palena koʻikoʻi, e like me ka maʻiʻo keleawe ma kēlā me kēia ʻāpana leo i loko o 0.52 (mass fraction) o ka mea kūʻai aku, pili i kahi uhi lahilahi, ʻano hoʻoheheʻe kemika ie hiki ke hoʻokō i nā koi. , akā, no ka mea, ke hoʻohana nei ka home i ke ala kuʻuna e pani ai i ka pā keleawe, ʻaʻole hiki i ka paʻa paʻa Plating kala ke hoʻokō i nā koi huahana A i ka hoʻomaʻamaʻa ʻana e koho i ke kaʻina hana kiʻi kiʻi mua, ka hoʻonui ʻia ʻana o ke keleawe a me ka thinning i ke kiʻi, e hiki i ka huahana. koi ʻO kēia ala e hāʻule pinepine ai ka uhi ʻana Hōʻike i ke ʻano No laila, koho maikaʻi ka ikaika paʻa aductility o ke keleawe plating kaʻina no e pili ana i kinoea pale kuʻihao uea mea nui loa I ka hou hiki ke hana kilika huahana hoʻokahi ka lanakila o kemika keleawe plating o ke keleawe paipu 'enehana i keia mua, nae hiki ke koho i ka mua axis anawaena, huki huahana hou ma hope o ke keleawe. ʻO ka ʻenehana plating e kūpono i kēia ʻenehana hana ʻo ka cyanide copper plating a i ʻole matte acidic copper plating No ka mea nui loa ka ʻona o ka cyanide, i ka metallurgy keleawe paipu mea hana ʻoihana he kakaikahi ka poʻe e hoʻohana I kēia manawa, ʻo ke ʻano kaulana loa ʻo ia ka chemical copper leaching. a laila mānoanoa ka pā keleawe a laila kaha kiʻi ʻia no ka hoʻopaʻa ʻana i ke keleawe no ka hoʻopaʻa ʻana i ke keleawe a i ʻole ka pyrophosphate i ke keleawe keleawe ma ka ʻoihana hoʻoheheʻe uea palahalaha e koho pū i ka hoʻoheheʻe keleawe maʻamau ka hoʻololi ʻana i ke keleawe keleawe he keleawe sulfate a me ke kaʻina sulfuric acid wale nō i ka manawa pōkole loa e hiki ke loaʻa i kahi. pani pani pani lahilahi loa, ma ka thic keleawe ma lunakening, ʻaʻole ikaika ka ikaika paʻa inā lōʻihi loa ka manawa o ka hoʻopaʻa ʻana i nā mea hoʻololi kemika, ʻaʻole wale ia e hoʻohui i ka mānoanoa o ka uhi ʻana, akā e hoʻoheheʻe ʻia ka uhi ʻana a me ka porous, ʻo ka hao matrix hoʻi e hana i ka corrosion, ua emi nui ka ikaika o ka uea. ʻO ke ʻano o ka hoʻohui ʻana i nā mea hoʻohui me ka hopena blocking i loko o ka hopena copper plating solution, no laila ke kaʻina hana hoʻololi i hoʻonohonoho pono i nā additives makemake a me kekahi hopena māmā i ka pono e loaʻa i kahi mānoanoa a i ʻole nā ​​​​huahana uea uhi mānoanoa. e akahele loa Ma ka liʻiliʻi loa, ʻaʻohe mea paʻa e hoʻololi i ka hoʻololi ʻana i ke kaʻina hana electroplating keleawe mānoanoa ma mua, e pili ana i ka mānoanoa o ka hoʻoheheʻe keleawe, pono ka ʻenehana paʻa e koho i ke ʻano electrochemical o precoated precoated me ka cyanide copper plating nickel plating a me ka P kiʻekiʻe. ʻO ka pyrophosphate copper plating ke kaupaona nei i nā pono a me nā hemahema, i ka ʻoihana kaha kiʻi uea, electrʻO ka oplating nickel plating e like me ka precoated render ʻoi aku ka maikaʻi ʻOiai hiki ke koho i ka pāpaʻi keleawe mānoanoa ke koho i ka acidic sulfate copper plating ʻO kēia no ka mea ma hope o ka hoʻololi ʻana i ke kaʻina hana, hiki i ka acid copper plating ke hoʻololi i nā koi o ka wikiwiki electroplating i kēia manawa hiki ke hiki i 30 ~ 50A / dm2, no laila. ʻAʻole pono e koho ʻia ka wikiwiki o ka hōʻiliʻili ʻana ma ke ʻano like ʻole, ʻaʻole pono ke koho ʻia ʻo cyanide copper plating no ka pollution environment pilikia, a me ka pyrophosphate copper plating no ka mea paʻakikī, ʻaʻole wale ke kumu kūʻai kiʻekiʻe, a ʻaʻole kūpono no ka hana i kēia manawa. kiʻekiʻe-wikiwiki electroplating o kaʻakika copper plating, i ka wā e piʻi ai ka nui o kēia manawa, e piʻi aʻe ka wikiwiki deposition o ka uhi i ka manawa like.


Ka manawa hoʻouna: Jan-14-2022